2016 IFESS Conference
Vol. 26 No. 4 (2016)
https://doi.org/10.4081/ejtm.2016.6298

Soft Encapsulation of Flexible Electrical Stimulation Implant: Challenges and Innovations

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Received: 19 September 2016
Published: 15 December 2016
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Soft encapsulation, Flexible electronics, Electrical stimulation

Authors

Adrien Debelle
addebell@ulb.ac.be
Ecole Polytechnique de Bruxelles, at the Université Libre de Bruxelles, Belgium.
Laura Hermans
Ecole Polytechnique de Bruxelles, at the Université Libre de Bruxelles, Belgium.
Maxime Bosquet
E.C.A.M., at the Haute Ecole Léonard de Vinci, Brussels, Belgium.
Sam Dehaeck
Ecole Polytechnique de Bruxelles, at the Université Libre de Bruxelles, Belgium.
Laurent Lonys
Ecole Polytechnique de Bruxelles, at the Université Libre de Bruxelles, Belgium.
Benoit Scheid
Ecole Polytechnique de Bruxelles, at the Université Libre de Bruxelles, Belgium.
Antoine Nonclercq
Ecole Polytechnique de Bruxelles, at the Université Libre de Bruxelles, Belgium.
Anne Vanhoestenberghe
Aspire Centre for Rehabilitation Engineering and Assistive Technology at University College London, United Kingdom.
In this document we discuss the main challenges encountered when producing flexible electrical stimulation implants, and present our approach to solving them for prototype production. We include a study of the optimization of the flexible PCB design, the selection of additive manufacturing materials for the mold, and the chemical compatibility of the different materials. Our approach was tested on a flexible gastro-stimulator as part of the ENDOGES research program.

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1.
Debelle A, Hermans L, Bosquet M, Dehaeck S, Lonys L, Scheid B, et al. Soft Encapsulation of Flexible Electrical Stimulation Implant: Challenges and Innovations. Eur J Transl Myol [Internet]. 2016 Dec. 15 [cited 2026 Apr. 17];26(4). Available from: https://www.pagepressjournals.org/bam/article/view/6298

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