Soft Encapsulation of Flexible Electrical Stimulation Implant: Challenges and Innovations


Submitted: 19 September 2016
Accepted: 19 September 2016
Published: 15 December 2016
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Authors

  • Adrien Debelle Ecole Polytechnique de Bruxelles, at the Université Libre de Bruxelles, Belgium.
  • Laura Hermans Ecole Polytechnique de Bruxelles, at the Université Libre de Bruxelles, Belgium.
  • Maxime Bosquet E.C.A.M., at the Haute Ecole Léonard de Vinci, Brussels, Belgium.
  • Sam Dehaeck Ecole Polytechnique de Bruxelles, at the Université Libre de Bruxelles, Belgium.
  • Laurent Lonys Ecole Polytechnique de Bruxelles, at the Université Libre de Bruxelles, Belgium.
  • Benoit Scheid Ecole Polytechnique de Bruxelles, at the Université Libre de Bruxelles, Belgium.
  • Antoine Nonclercq Ecole Polytechnique de Bruxelles, at the Université Libre de Bruxelles, Belgium.
  • Anne Vanhoestenberghe Aspire Centre for Rehabilitation Engineering and Assistive Technology at University College London, United Kingdom.
In this document we discuss the main challenges encountered when producing flexible electrical stimulation implants, and present our approach to solving them for prototype production. We include a study of the optimization of the flexible PCB design, the selection of additive manufacturing materials for the mold, and the chemical compatibility of the different materials. Our approach was tested on a flexible gastro-stimulator as part of the ENDOGES research program.

Debelle, A., Hermans, L., Bosquet, M., Dehaeck, S., Lonys, L., Scheid, B., Nonclercq, A., & Vanhoestenberghe, A. (2016). Soft Encapsulation of Flexible Electrical Stimulation Implant: Challenges and Innovations. European Journal of Translational Myology, 26(4). https://doi.org/10.4081/ejtm.2016.6298

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